Product features:

The stacked magnetic beads do not need to be wound, but instead use micrometer scale ferrite thin sheets for lamination. Each magnetic layer has printed conductor patterns and holes, filled with conductor materials to connect the upper and lower layers. After pressurization and sintering, they form an integrated multi-layer inductor. This type of chip inductor production process is more suitable for miniaturization, easy to achieve large-scale production, and suitable for high-frequency product applications.

Product application:

Suitable for noise suppression measures in IC power supply lines of image display devices, communication devices, video players, audio players, remote controls, smartphones, OA devices, laptops, and other devices.